K20 series 2D Automated Optical InspectionOnline dual track
| 2D Automated Optical Inspection Online dual track |
| Model | K2012DT |
| Testing Capability | Test items | CHIP component body, CHIP component solder joints, characters, DIP solder joints |
| Minimum component | CHIP:01005 Pitch:0.3mm |
| Detection Method | Algorithm Parameter Debugging, Machine Learning |
| Optical System | Camera | 12MP high-speed color industrial camera |
| Telecentric Lens | 0.36X/0.23X |
| Resolution | 10um/15um |
| FOV | 40x30mm /60x45mm |
| Detection Speed | 3FOV/s |
| Software System | Operating System | Windows10 |
| Mechanical Properties | PCB thickness | 0.3~10mm(Warp≤5mm) |
| Component Height | Upper 30mm, lower 84mm(special height can be customized) |
| Driving device | Servomotor+Ball Screw+Linear Guideway |
| Moving speed | Max.600mm/s |
| Positioning accuracy | ≤8um(after calibration) |
| PCB transport guide | PCB rail transportation height:900+20mm(from ground to PCB rail transportation surface) |
| PCB maximum size: 600mmxW300mm (dual rail, double PCB) 600mmxW580mm (single rail, single PCB) |
| Minimum distance between PCBs:≤90mm |
| Parameters | Curing method | AC220V/50Hz/2000W |
| Detection screen | W1000mmxD1380mmxH1600mm(without foot 100±20mm) |
| Accuracy | 1100KG |
| Re-measurement Accuracy | ≥0.5MPa |
| Wafer Ring Size | Temperature:5~40℃, relative humidity 25%~80%(no frost) |
| Number of wafers handledsimultaneously | Standard SMEMA interface |
Independent intellectual property image processing software.Linear scanning has the shortest stroke and the fastest speed.
Multi-angle light sources highlight solder joints, silk screen and other features.Constant current controller ensures the brightness consistency of the light source.
Standard 5MP global exposure industrial color camera, and optional 12MP camera, etc.
Large-diameter telecentric lens, low distortion, no squint, large depth of field that accommodates components with differing heights.
Product testing capabilities(Online Dual-Track)
1.Misplacement 2. Missing Component 3. Polarity Reversal 4. Non-Wetting 5. Solder Hole 6. Collinear Anomaly 7. Poor soldering 8. Pin Warpage
9. Insufficient Soldering 10. Short Circuit 11. Offset 12.DIP Component Missing 13.DIP pins unextended......
MES data docking function and powerful SPC system
1. Real-time statistics of the top10 alarm components
2. Enables setting an alarm count to automatically halt upstream equipment.
3. Export the entire board image of each PCB in real time for subsequent traceability
4. Indigenously developed MES interface supports standard and customized formats.
Labor-saving mode
Through data transmission and other methods, one person can view the AOI alarm data of multiple lines, thereby realizing a man-saving mode.
Product Tags:
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2D PCB SMT AOI Machine Inspection Equipment Automated Classification Images
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